ALICE 2 detector systems (see legend and text for details).

Accumulation of integrated luminosity over time for different trigger types in pp (left) and \PbPb (right) collisions during LHC Run 2.

Time frame and heartbeat frame structure in continuous and triggered mode. HeartBeat (HB) triggers are issued in continuous and triggered modes to all upgraded detectors. Physics triggers can be sent to upgraded detectors in triggered mode and are sent to non-upgraded detectors in all modes. HBF and TF rates are programmable with the following nominal values; HBF: 1 every orbit, $\sim$89.4 µs/$\sim$10 kHz, TF: 1 TF every 128 HBFs/$\sim$11 ms/$\sim$100 Hz.

ALICE readout and control system architecture.

Block diagram of the common readout unit (CRU): the CRU forms the interface between the first-level processors (via PCIe), the central trigger system (via TTS), and the detectors (via TTS and FE).

Picture of a CRU; bottom left, FPGA cooling radiator, bottom right, power mezzanine; top row; 3 out of 8 Minipods installed; top left, fiber optics cable to MPO connector on front panel; bottom left, SFP transceivers.

Schematic cross-section of a pixel cell.

Architecture of the ALPIDE chip.

Block diagram of the ALPIDE chip.

Diagrams of the ITS2 inner barrel and outer barrel modules.

ALPIDE sensor chip detection efficiency and fake-hit rate vs global threshold setting. Beam test results (\SI{6}{\giga eV/\it{c}} pions, orthogonal incidence). ALPIDE substrate reverse bias: \SI{-3}{\volt}.

ALPIDE chip hit-position resolution and average cluster size as a function of global threshold setting. Beam test results with \SI{6}{\giga eV/\it{c}} pions with perpendicular incidence. ALPIDE substrate reverse bias: ${\rm -3 V}$.

Block diagram of the SAMPA ASIC.

Block diagram of the front-end implemented in the SAMPA ASIC.

Block diagram of the SAMPA SAR ADC.

Diagram of digital signal processing chain in the SAMPA.

SAMPA bare die (left) and TFBGA packaged chip (right).

Example response curve for 4\,mV/fC configuration.

Schematic layout of the ITS2. The three innermost layers form the inner barrel, the middle and outer layers form the outer barrel.

Layout of the staves of the inner and outer barrels.

Inner HIC seen from the sensor side. The green tabs are used for fixing and handling, and are removed before mounting the HIC.

Top view and bottom view of an outer barrel HIC. The yellow cables connect the HIC to the power bus.

Pictures of the ITS2 assembly. Top left: A view of the MAM used for chip inspection and HIC assembly. Top right: Photo of an outer barrel stave, with power bus cables opened on the two sides. Bottom: Photo of an inner barrel stave, with detailed views shown in the insert.

Space frame and cold plate cooling scheme (Left) Inner Barrel; (Right) Outer Barrel.

Azimuthal distribution of single contributions to the material budget of an inner (left) and outer (right) barrel stave layer. The relative contribution of each component to the total material budget is quoted.

Overview of the mechanical structure of the ITS2. The upper panel shows the Inner Barrel, the Outer Barrel staves and the MFT in the back. The lower panel shows the IB and OB conical structural shells supporting the respective services.

Schematic design and interconnections of the ITS2 readout unit.

Schematic description of the stave production workflow.

ITS2 in the clean room during on-surface commissioning. The lower left shows a zoomed-in view of the half barrels of the outer barrel (OB) and inner barrel (IB) type.

Fake-hit rate of an inner half-barrel as a function of the number of masked pixels.

Top: Outer barrel surrounding the beam pipe with the Muon Forward Tracker (MFT) in the background. Bottom: ITS2 inner barrel bottom half-barrel next to the beam pipe, outer barrel and MFT in the background.

Event display of a cosmic muon traversing all layers of ITS2 twice, no magnetic field.

Longitudinal distribution of the primary vertex positions from ITS2 tracks reconstructed online during the LHC pilot beam in October 2021.  .

Schematic view of the Muon Forward Tracker (left) and its integration with the central barrel (right).

Detailed view of the elements composing the MFT detector.

Example of an assembled MFT ladder. Upper picture: back side of the FPC with the glue spots on which the sensor are glued. Bottom picture: front view of assembled ladder.

Exploded view of a half-disk (D00-01).

Left: Half-disk during ladder gluing. Right: Glue deposition pattern.

Half-cone structure with air ducts in light blue.

MFT PSU boards with mezzanine assembled on their support.

Noise occupancy, measured in hit/pixel/event as a function of the number of masked pixels over the whole MFT detector.

Display of the reconstructed muon tracks in the MFT from a TED shot event.

Schematic view of the ALICE TPC.

Schematic view of a stack with four GEM foils. The baseline settings for the voltages across the four GEMs, the transfer fields between the GEMs, and the induction field between GEM\,4 and the pad plane are indicated as well.

Energy resolution $\sigma(^{55}\rm{Fe})$ as a function of ion backflow (IBF) in a 4-GEM stack (S-LP-LP-S) in Ne-CO$_2$-N$_2$ (90-10-5) The gas gain is kept at 2000 in all measurements by adjusting the voltages on GEM\,3 and GEM\,4 at a fixed ratio of 0.8 or 0.95. Figure from  .

Exploded view of an IROC with chamber body components and GEM frames. Figure taken from .